Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfaci...
Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging
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New York: Springer US
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Language
English
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New York: Springer US
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Contents
To analyze the effects of Ni(P) layer thickness and Pd layer composition on interfacial reactions and the mechanical reliabilities of Sn–58Bi solder joints, we evaluated a phosphorous-contained Ni (Ni(P)) layer thicknesses ranging from 0.3 to 1.0 μm with Au/Pd/Ni(P) or a phosphorous-contained Pd [Au/Pd(P)/Ni(P)] layer in thin-electroless-nickel ele...
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Full title
Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging
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TN_cdi_proquest_journals_2473222467
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2473222467
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ISSN
0957-4522
E-ISSN
1573-482X
DOI
10.1007/s10854-020-04509-x
