Observed edge radius behavior during MD nanomachining of silicon at a high uncut chip thickness
Observed edge radius behavior during MD nanomachining of silicon at a high uncut chip thickness
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Publisher
London: Springer London
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Language
English
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Publisher
London: Springer London
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Contents
During ultraprecision turning of optical silicon, size effect determined by the ratio of undeformed chip thickness to tool cutting edge radius remains an important determinant of both compressive and shear stresses in the workpiece around the cutting edge (cutting zone). Plastic deformation which is a factor of both stresses is considered crucial t...
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Full title
Observed edge radius behavior during MD nanomachining of silicon at a high uncut chip thickness
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TN_cdi_proquest_journals_2490846998
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2490846998
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ISSN
0268-3768
E-ISSN
1433-3015
DOI
10.1007/s00170-018-3001-y
