Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High...
Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test
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New York: Springer US
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English
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New York: Springer US
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Contents
In the 3D integrated circuit package industry, the remelting of solder joints during repeated stacking processes can cause electrical failure and low bonding strength. Transient liquid phase sintering (TLPS) bonding based on forming full intermetallic compounds (IMCs) in the solder joint to increase the remelting point has emerged as a potential so...
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Full title
Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test
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TN_cdi_proquest_journals_2565932285
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2565932285
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ISSN
0361-5235
E-ISSN
1543-186X
DOI
10.1007/s11664-021-09102-4
