Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse co...
Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board
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Publisher
New York: Springer US
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Language
English
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Publisher
New York: Springer US
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Contents
The growth of IMCs at solder/substrate interface becomes more important with the sustaining advancement of integrated circuit technology. The purpose of this study was to investigate the morphology and growth kinetics of the intermetallic compounds (IMCs) formed on the diverse copper lines (including electroless copper, electroplated copper, sputte...
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Full title
Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board
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TN_cdi_proquest_journals_2566146806
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2566146806
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ISSN
0957-4522
E-ISSN
1573-482X
DOI
10.1007/s10854-021-06723-7
