Thermomigration behavior of Sn–Bi joints under different substrate
Thermomigration behavior of Sn–Bi joints under different substrate
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Publisher
New York: Springer US
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Language
English
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Publisher
New York: Springer US
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Contents
In this work, the atomic migration behavior in Sn-58Bi solder joints was investigated under the condition of a temperature gradient. The effect of different substrates including Cu, Ni and Co on microstructural evolution in the solder was also compared. It was found that the main migrating element in Sn-58Bi solder was Bi in the direction of temper...
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Full title
Thermomigration behavior of Sn–Bi joints under different substrate
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TN_cdi_proquest_journals_2645689218
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2645689218
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ISSN
0957-4522
E-ISSN
1573-482X
DOI
10.1007/s10854-022-07962-y
