94 results for Thermomigration

94 results for Thermomigration

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    ArticlesPeer ReviewedFull Text

    Author / Creator:Hou, Ruiqing ; Zhang, Keke ; Zhao, Wenjia ; Zhang, Haizhou ; Zhang, Chao ; Wang, Yonglei
    Publisher:London: Nature Publishing Group UK
    Journal title:Scientific reports, 2025-03, Vol.15 (1), p.8420-11, Article 8420
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Wu, Jun ; Wang, Kaipeng ; Wang, Fengjiang ; Liao, Mingqing
    Publisher:New York: Springer US
    Journal title:Journal of materials science. Materials in electronics, 2022-04, Vol.33 (10), p.8127-8139
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Xie, De-Gang ; Nie, Zhi-Yu ; Shinzato, Shuhei ; Yang, Yue-Qing ; Liu, Feng-Xian ; Ogata, Shigenobu ; Li, Ju ; Ma, Evan ; Shan, Zhi-Wei
    Publisher:London: Nature Publishing Group UK
    Journal title:Nature communications, 2019-10, Vol.10 (1), p.4478-8, Article 4478
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Liu, Peng ; Cong, Sen ; Wang, Shaobin ; Wu, Ping
    Publisher:New York: Springer US
    Journal title:Journal of materials science, 2023-07, Vol.58 (26), p.10753-10763
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Somaiah, Nalla ; Kumar, Praveen
    Publisher:New York: Springer US
    Journal title:Journal of electronic materials, 2020-01, Vol.49 (1), p.96-108
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    Author / Creator:Baek, Sung-Min ; Park, Yujin ; Oh, Cheolmin ; Chun, Eun-Joon ; Kang, Namhyun
    Publisher:New York: Springer US
    Journal title:Journal of electronic materials, 2019-01, Vol.48 (1), p.142-151
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Seredin, Boris M. ; Popov, Victor P. ; Malibashev, Alexander V. ; Gavrus, Igor V. ; Loganchuk, Sergey M. ; Martyushov, Sergey Y.
    Publisher:Dordrecht: Springer Netherlands
    Journal title:SILICON, 2024-06, Vol.16 (8), p.3453-3460
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Fan, Yuchun ; Zhang, Keke ; Chen, Weiming ; Wu, Jinna ; Wang, Yonglei
    Publisher:Basel: MDPI AG
    Journal title:Metals (Basel ), 2024-12, Vol.14 (12), p.1420
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    Author / Creator:Du, Yanfeng ; Qiao, Yuanyuan ; Ren, Xiaolei ; Lai, Yanqing ; Zhao, Ning
    Publisher:Basel: MDPI AG
    Journal title:Electronics (Basel), 2023-04, Vol.12 (8), p.1899
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    Author / Creator:Chen, Hsiao-Yun ; Chen, Chih
    Publisher:New York, USA: Cambridge University Press
    Journal title:Journal of materials research, 2011-04, Vol.26 (8), p.983-991
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Lozovskiy, V.N. ; Seredin, B.M. ; Arkhipova, N.Yu
    Publisher:Pfaffikon: Trans Tech Publications Ltd
    Journal title:Materials science forum, 2016-02, Vol.843, p.46-51
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Lomov, A. A. ; Seredin, B. M. ; Martyushov, S. Yu ; Zaichenko, A. N. ; Shul’pina, I. L.
    Publisher:Moscow: Pleiades Publishing
    Journal title:Technical physics, 2021-03, Vol.66 (3), p.453-460
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Guo, Fu ; Liu, Qian ; Ma, Limin ; Zuo, Yong
    Publisher:New York, USA: Cambridge University Press
    Journal title:Journal of materials research, 2016-06, Vol.31 (12), p.1793-1800
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Zhao, N. ; Deng, J. F. ; Zhong, Y. ; Huang, M. L. ; Ma, H. T.
    Publisher:New York: Springer US
    Journal title:Journal of electronic materials, 2017-04, Vol.46 (4), p.1931-1936
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Garmashov, S. I.
    Publisher:Moscow: Pleiades Publishing
    Journal title:Physics of the solid state, 2019-12, Vol.61 (12), p.2291-2294
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Zhong, Yi ; Zhao, Ning ; Dong, Wei ; Ma, Haitao ; Huang, Mingliang ; Yin, Luqiao ; Wong, Chingping
    Publisher:New York, USA: Cambridge University Press
    Journal title:Journal of materials research, 2017-08, Vol.32 (16), p.3128-3136
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Su, Yu-Ping ; Wu, Chun-Sen ; Ouyang, Fan-Yi
    Publisher:New York: Springer US
    Journal title:Journal of electronic materials, 2016-01, Vol.45 (1), p.30-37
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Gu, X. ; Yung, K. C. ; Chan, Y. C. ; Yang, D.
    Publisher:Boston: Springer US
    Journal title:Journal of materials science. Materials in electronics, 2011-03, Vol.22 (3), p.217-222
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Lozovskii, V. N. ; Lomov, A. A. ; Lunin, L. S. ; Seredin, B. M. ; Chesnokov, Yu. M.
    Publisher:Moscow: Pleiades Publishing
    Journal title:Semiconductors (Woodbury, N.Y.), 2017-03, Vol.51 (3), p.285-289
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    ArticlesPeer ReviewedFull Text

    Author / Creator:Wei, G. Q. ; Du, L. C. ; Jia, Y. P. ; Qi, L.
    Publisher:New York: Springer US
    Journal title:Journal of materials science. Materials in electronics, 2015-06, Vol.26 (6), p.4313-4317
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