Structural design and thermodynamic analysis of high heat dissipation on board computers based on VP...
Structural design and thermodynamic analysis of high heat dissipation on board computers based on VPX architecture
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Bristol: IOP Publishing
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English
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Bristol: IOP Publishing
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Due to the excellent compatibility of VPX in the international aerospace embedded specifications, VPX specifications are often employed in the design of payload processors for space applications. This paper introduces the design features of a 3U hot-swappable chassis based on the VPX specification, focusing on overall layout and thermal design. To...
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Structural design and thermodynamic analysis of high heat dissipation on board computers based on VPX architecture
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TN_cdi_proquest_journals_3117597699
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_3117597699
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ISSN
1742-6588
E-ISSN
1742-6596
DOI
10.1088/1742-6596/2853/1/012031
