Assessment of residual stresses during cure and cooling of epoxy resins
Assessment of residual stresses during cure and cooling of epoxy resins
About this item
Full title
Author / Creator
Publisher
Brookfield: Society of Plastics Engineers
Journal title
Language
English
Formats
Publication information
Publisher
Brookfield: Society of Plastics Engineers
Subjects
More information
Scope and Contents
Contents
A new stress monitoring technique, a stress‐tracking device, is described here. It has been used to study some important properties of epoxy resin. Residual stresses, including a curing shrinkage stress and a cooling shrinkage stress, were measured automatically and continuously during curing and cooling. Simultaneously, information such as an appa...
Alternative Titles
Full title
Assessment of residual stresses during cure and cooling of epoxy resins
Authors, Artists and Contributors
Author / Creator
Identifiers
Primary Identifiers
Record Identifier
TN_cdi_proquest_miscellaneous_26005710
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_miscellaneous_26005710
Other Identifiers
ISSN
0032-3888
E-ISSN
1548-2634
DOI
10.1002/pen.760352309
