Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds
Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds
About this item
Full title
Author / Creator
Hu, Jie and Yu, Min-Feng
Publisher
Washington, DC: American Association for the Advancement of Science
Journal title
Language
English
Formats
Publication information
Publisher
Washington, DC: American Association for the Advancement of Science
Subjects
More information
Scope and Contents
Contents
Continued progress in the electronics industry depends on downsizing, to a few micrometers, the wire bonds required for wiring integrated chips into circuit boards. We developed an electrodeposition method that exploits the thermodynamic stability of a microscale or nanoscale liquid meniscus to "write" pure copper and platinum three-dimensional str...
Alternative Titles
Full title
Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds
Authors, Artists and Contributors
Author / Creator
Identifiers
Primary Identifiers
Record Identifier
TN_cdi_proquest_miscellaneous_734001207
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_miscellaneous_734001207
Other Identifiers
ISSN
0036-8075
E-ISSN
1095-9203
DOI
10.1126/science.1190496
