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Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits

Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_miscellaneous_734200138

Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits

About this item

Full title

Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits

Publisher

United States: National Academy of Sciences

Journal title

Proceedings of the National Academy of Sciences - PNAS, 2009-12, Vol.106 (50), p.21035-21038

Language

English

Formats

Publication information

Publisher

United States: National Academy of Sciences

More information

Scope and Contents

Contents

Three-dimensional (3D), multi-transistor-layer, integrated circuits represent an important technological pursuit promising advantages in integration density, operation speed, and power consumption compared with 2D circuits. We report fully functional, 3D integrated complementary metal-oxide-semiconductor (CMOS) circuits based on separate interconne...

Alternative Titles

Full title

Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits

Authors, Artists and Contributors

Identifiers

Primary Identifiers

Record Identifier

TN_cdi_proquest_miscellaneous_734200138

Permalink

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_miscellaneous_734200138

Other Identifiers

ISSN

0027-8424

E-ISSN

1091-6490

DOI

10.1073/pnas.0911713106

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