Dow Global Technologies LLC, Bai Chenyan, Chen Hongyu, Schmidt Thorsten, Yu Yingfeng and Dong Haijun...

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_wirefeeds_2673611295

Dow Global Technologies LLC, Bai Chenyan, Chen Hongyu, Schmidt Thorsten, Yu Yingfeng and Dong Haijun File Patent Application for Adhesive Composition

Full title

Dow Global Technologies LLC, Bai Chenyan, Chen Hongyu, Schmidt Thorsten, Yu Yingfeng and Dong Haijun File Patent Application for Adhesive Composition

Publisher

New Delhi: Athena Information Solutions Pvt. Ltd

Journal title

Indian Patents News, 2022

Language

English

Formats

Publisher

New Delhi: Athena Information Solutions Pvt. Ltd

Subjects and topics

Full title

Dow Global Technologies LLC, Bai Chenyan, Chen Hongyu, Schmidt Thorsten, Yu Yingfeng and Dong Haijun File Patent Application for Adhesive Composition

Record Identifier

TN_cdi_proquest_wirefeeds_2673611295

Permalink

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_wirefeeds_2673611295

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