Hindusthan College of Engineering and Technology Files Patent Application for Design and Fabrication...
Hindusthan College of Engineering and Technology Files Patent Application for Design and Fabrication of Low Cost Mould by Aramid Fibre Reinforced Polymer (AFRP) Using 3D Printer
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Full title
Hindusthan College of Engineering and Technology Files Patent Application for Design and Fabrication of Low Cost Mould by Aramid Fibre Reinforced Polymer (AFRP) Using 3D Printer
Publisher
New Delhi: Athena Information Solutions Pvt. Ltd
Journal title
Indian Patents News, 2022
Language
English
Formats
Publication information
Publisher
New Delhi: Athena Information Solutions Pvt. Ltd
Subjects
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Alternative Titles
Full title
Hindusthan College of Engineering and Technology Files Patent Application for Design and Fabrication of Low Cost Mould by Aramid Fibre Reinforced Polymer (AFRP) Using 3D Printer
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Record Identifier
TN_cdi_proquest_wirefeeds_2709845203
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_wirefeeds_2709845203
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