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ArticlesPeer ReviewedFull Text
An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics
Author / Creator:Chen, Zehua ; Gengenbach, Ulrich ; Liu, Xinnan ; Scholz, Alexander ; Zimmermann, Lukas ; Aghassi-Hagmann, Jasmin ; Koker, Liane
Publisher:Switzerland: MDPI AG
Journal title:Micromachines (Basel), 2022-04, Vol.13 (4), p.583
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Newsletter articlesFull Text
Patent Issued for Flex on board anisotropic conductive adhesive interconnection (USPTO 11259414)
Publisher:NewsRX LLC
Journal title:China Weekly News, 2022
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Newsletter articlesFull Text
Huawei Technologies Co Ltd issued patent titled "Flex on board anisotropic conductive adhesive interconnection"
Publisher:Melbourne: News Bites Pty Ltd
Journal title:News Bites - Private Companies, 2022
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Newsletter articlesFull Text
US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Feb. 22 for "Flex on board anisotropic conductive adhesive interconnection" (Finnish, Swedish, Chinese Inventors)
Publisher:Washington, D.C: HT Digital Streams Limited
Journal title:US Fed News Service, Including US State News, 2022
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Newsletter articlesFull Text
WIPO PUBLISHES PATENT OF DAVID POWNEY AND HUAWEI TECHNOLOGIES FOR "FLEX ON BOARD ANISOTROPIC CONDUCTIVE ADHESIVE INTERCONNECTION" (SWEDISH, FINNISH INVENTORS)
Publisher:Washington, D.C: HT Digital Streams Limited
Journal title:US Fed News Service, Including US State News, 2019
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ArticlesPeer ReviewedFull Text
Rate-dependent mechanical properties of cured conductive adhesives and drop impact behavior of adhesive bonding points in electronic interconnection
Author / Creator:Xiao, Gesheng ; Wang, Tiejun ; Shu, Xuefeng ; Ma, Yuhong ; Ji, Xinkuo
Publisher:New York: Springer US
Journal title:Journal of materials science. Materials in electronics, 2022-05, Vol.33 (15), p.11946-11957
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An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics

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Patent Issued for Flex on board anisotropic conductive adhesive interconnection (USPTO 11259414)

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Huawei Technologies Co Ltd issued patent titled "Flex on board anisotropic conductive adhesive interconnection"

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US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Feb. 22 for "Flex on board anisotropic conductive adhesive interconnection" (Finnish, Swedish, Chinese Inventors)

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WIPO PUBLISHES PATENT OF DAVID POWNEY AND HUAWEI TECHNOLOGIES FOR "FLEX ON BOARD ANISOTROPIC CONDUCTIVE ADHESIVE INTERCONNECTION" (SWEDISH, FINNISH INVENTORS)

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Rate-dependent mechanical properties of cured conductive adhesives and drop impact behavior of adhesive bonding points in electronic interconnection

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