Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints
Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints
About this item
Full title
Author / Creator
Publisher
Basel: MDPI AG
Journal title
Language
English
Formats
Publication information
Publisher
Basel: MDPI AG
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More information
Scope and Contents
Contents
Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playing an important role in reliability issues due to...
Alternative Titles
Full title
Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints
Authors, Artists and Contributors
Author / Creator
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Primary Identifiers
Record Identifier
TN_cdi_pubmedcentral_primary_oai_pubmedcentral_nih_gov_9324842
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_pubmedcentral_primary_oai_pubmedcentral_nih_gov_9324842
Other Identifiers
ISSN
1996-1944
E-ISSN
1996-1944
DOI
10.3390/ma15145086
