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ArticlesPeer ReviewedFull Text
Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition
Author / Creator:Takakura, Ryo ; Murakami, Seigo ; Watanabe, Kaname ; Takigawa, Ryo
Publisher:London: Nature Publishing Group UK
Journal title:Scientific reports, 2023-03, Vol.13 (1), p.3581-3581, Article 3581
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ArticlesPeer ReviewedFull Text
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging
Author / Creator:Matsumae, Takashi ; Kariya, Shingo ; Kurashima, Yuichi ; Thu, Le Hac Huong ; Higurashi, Eiji ; Hayase, Masanori ; Takagi, Hideki
Publisher:Basel: MDPI AG
Journal title:Sensors (Basel, Switzerland), 2022-10, Vol.22 (21), p.8144
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ArticlesPeer ReviewedFull Text
PMMA Solution Assisted Room Temperature Bonding for PMMA⁻PC Hybrid Devices
Author / Creator:Song, In-Hyouk ; Park, Taehyun
Publisher:Switzerland: MDPI AG
Journal title:Micromachines (Basel), 2017-09, Vol.8 (9), p.284
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ArticlesPeer ReviewedFull Text
Room Temperature Bonding on Interface Between Metal and Ceramic
Author / Creator:Jang, Kyu-Bong ; Mhin, Sungwook ; Lim, Sung-Chul ; Song, Young-Sik ; Lee, Keun-Hyo ; Park, Soo-Keun ; Moon, Kyoung-Il ; Lee, Seung Hwan ; Hyun, Soong-Keun
Publisher:New York: Springer US
Journal title:Journal of electronic materials, 2019-01, Vol.48 (1), p.72-78
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ArticlesPeer ReviewedFull Text
Room-temperature bonding strategy by ultra-high isostatic pressing for a heterogeneous interconnection architecture
Author / Creator:Guo, Fen ; Li, Tuo ; Man, Hong Tao ; Liu, Kai ; Zou, Xiao Feng ; Wang, Xiao Liang
Publisher:New York: Springer US
Journal title:Journal of materials science. Materials in electronics, 2022-01, Vol.33 (3), p.1480-1488
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ArticlesPeer ReviewedFull Text
Room-temperature bonding of Al 2 O 3 thin films deposited using atomic layer deposition
Author / Creator:Takakura, Ryo ; Murakami, Seigo ; Watanabe, Kaname ; Takigawa, Ryo
Publisher:England
Journal title:Scientific reports, 2023-03, Vol.13 (1), p.3581
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ArticlesPeer ReviewedFull Text
A room-temperature bonding technique for the packaging of hydrogel-based hybrid microfluidic devices
Author / Creator:Santaniello, Tommaso ; Yan, Yunsong ; Tocchio, Alessandro ; Martello, Federico ; Milani, Paolo ; Lenardi, Cristina
Publisher:Berlin/Heidelberg: Springer Berlin Heidelberg
Journal title:Microfluidics and nanofluidics, 2015-07, Vol.19 (1), p.31-41
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ArticlesPeer ReviewedFull Text
Development of STJ for neutron detector on Si-LBO hybrid substrate by surface-activated room-temperature bonding
Author / Creator:Endo, S ; Fujii, G ; Ukibe, M ; Takagi, H ; Ohkubo, M ; Naruse, M ; Myoren, H ; Otani, C ; Taino, T
Publisher:Bristol: IOP Publishing
Journal title:Journal of physics. Conference series, 2017-07, Vol.871 (1), p.12070
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ArticlesPeer ReviewedFull Text
Microstructure and Properties of Magnesium Alloy Joints Bonded by Using Gallium with the Assistance of Ultrasound at Room Temperature
Author / Creator:Fang, Qiuyue ; Guo, Zuoxing ; Zhao, Liang ; Liu, Yuhua
Publisher:Basel: MDPI AG
Journal title:Materials, 2023-11, Vol.16 (21), p.6994
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ArticlesPeer ReviewedFull Text
Hermeticity Analysis on SiC Cavity Structure for All-SiC Piezoresistive Pressure Sensor
Author / Creator:Tian, Baohua ; Shang, Haiping ; Zhao, Lihuan ; Wang, Dahai ; Liu, Yang ; Wang, Weibing
Publisher:Switzerland: MDPI AG
Journal title:Sensors (Basel, Switzerland), 2021-01, Vol.21 (2), p.379
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ArticlesPeer ReviewedFull Text
Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding
Author / Creator:Yamamoto, Michitaka ; Matsumae, Takashi ; Kurashima, Yuichi ; Takagi, Hideki ; Suga, Tadatomo ; Takamatsu, Seiichi ; Itoh, Toshihiro ; Higurashi, Eiji
Publisher:Switzerland: MDPI
Journal title:Micromachines (Basel), 2020-04, Vol.11 (5), p.454
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ArticlesFull Text
Review of Low-Temperature Bonding Technologies and Their Application in Optoelectronic Devices
Author / Creator:HIGURASHI, EIJI ; SUGA, TADATOMO
Publisher:Blackwell Publishing Ltd
Journal title:Electronics and communications in Japan, 2016-03, Vol.99 (3), p.63-71
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ArticlesPeer ReviewedFull Text
Fabrication of SiC Sealing Cavity Structure for All-SiC Piezoresistive Pressure Sensor Applications
Author / Creator:Zhao, Lihuan ; Shang, Haiping ; Wang, Dahai ; Liu, Yang ; Tian, Baohua ; Wang, Weibing
Publisher:Switzerland: MDPI AG
Journal title:Materials, 2020-12, Vol.14 (1), p.128
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ArticlesPeer ReviewedFull Text
Flexible Capillary Microfluidic Devices Based on Surface-Energy Modified Polydimethylsiloxane and Polymethylmethacrylate with Room-Temperature Chemical Bonding
Author / Creator:Huyen, Lai Thi Ngoc ; Hong, Seok Ju ; Trung, Tran Quang ; Meeseepong, Montri ; Kim, A Ri ; Lee, Nae-Eung
Publisher:Seoul: The Korean BioChip Society (KBCS)
Journal title:Biochip journal, 2023-03, Vol.17 (1), p.120-132
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ArticlesPeer ReviewedFull Text
An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics
Author / Creator:Chen, Zehua ; Gengenbach, Ulrich ; Liu, Xinnan ; Scholz, Alexander ; Zimmermann, Lukas ; Aghassi-Hagmann, Jasmin ; Koker, Liane
Publisher:Switzerland: MDPI AG
Journal title:Micromachines (Basel), 2022-04, Vol.13 (4), p.583
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ArticlesPeer ReviewedFull Text
Effect of the surface treatment on the room-temperature bonding of Al to Si and SiO2
Author / Creator:HOSODA, N ; KYOGOKU, Y ; SUGA, T
Publisher:Heidelberg: Springer
Journal title:Journal of materials science, 1998, Vol.33 (1), p.253-258
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Newsletter articlesFull Text
Patent Issued for Room-Temperature Bonding Apparatus (USPTO 9443711)
Publisher:NewsRX LLC
Journal title:China Weekly News, 2016, p.986
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ArticlesPeer ReviewedFull Text
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
Author / Creator:Fukushima, Takafumi ; Konno, Takayuki ; Iwata, Eiji ; Kobayashi, Risato ; Kojima, Toshiya ; Murugesan, Mariappan ; Bea, Ji-Chel ; Lee, Kang-Wook ; Tanaka, Tetsu ; Koyanagi, Mitsumasa
Publisher:Basel: MDPI AG
Journal title:Micromachines (Basel), 2011-03, Vol.2 (1), p.49-68
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Newsletter articlesFull Text
Patent Application Titled "Room-Temperature Bonding Apparatus" Published Online (USPTO 20170162428)
Publisher:NewsRX LLC
Journal title:China Weekly News, 2017, p.899
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Newsletter articlesFull Text
INTERNATIONAL PATENT: NIDEC MACHINE TOOL CORPORATION, KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION FILES APPLICATION FOR "SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ROOM TEMPERATURE BONDING D...
Publisher:Washington, D.C: HT Digital Streams Limited
Journal title:US Fed News Service, Including US State News, 2022
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Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition

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Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging

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PMMA Solution Assisted Room Temperature Bonding for PMMA⁻PC Hybrid Devices

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Room Temperature Bonding on Interface Between Metal and Ceramic

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Room-temperature bonding strategy by ultra-high isostatic pressing for a heterogeneous interconnection architecture

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Room-temperature bonding of Al 2 O 3 thin films deposited using atomic layer deposition

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A room-temperature bonding technique for the packaging of hydrogel-based hybrid microfluidic devices

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Development of STJ for neutron detector on Si-LBO hybrid substrate by surface-activated room-temperature bonding

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Microstructure and Properties of Magnesium Alloy Joints Bonded by Using Gallium with the Assistance of Ultrasound at Room Temperature

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Hermeticity Analysis on SiC Cavity Structure for All-SiC Piezoresistive Pressure Sensor

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Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding

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Review of Low-Temperature Bonding Technologies and Their Application in Optoelectronic Devices

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Fabrication of SiC Sealing Cavity Structure for All-SiC Piezoresistive Pressure Sensor Applications

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Flexible Capillary Microfluidic Devices Based on Surface-Energy Modified Polydimethylsiloxane and Polymethylmethacrylate with Room-Temperature Chemical Bonding

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An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics

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Effect of the surface treatment on the room-temperature bonding of Al to Si and SiO2

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Patent Issued for Room-Temperature Bonding Apparatus (USPTO 9443711)

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Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

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Patent Application Titled "Room-Temperature Bonding Apparatus" Published Online (USPTO 20170162428)

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INTERNATIONAL PATENT: NIDEC MACHINE TOOL CORPORATION, KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION FILES APPLICATION FOR "SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ROOM TEMPERATURE BONDING D...

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