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Select record 21
ArticlesPeer ReviewedFull Text
Carbon-Based Electrode Materials for Microsupercapacitors in Self-Powering Sensor Networks: Present and Future Development
Author / Creator:Smith, A. ; Li, Qi ; Vyas, Agin ; Haque, Mohammad ; Wang, Kejian ; Velasco, Andres ; Zhang, Xiaoyan ; Thurakkal, Shameel ; Quellmalz, Arne ; Niklaus, Frank ; Gylfason, Kristinn ; Lundgren, Per ; Enoksson, Peter
Publisher:Basel: MDPI AG
Journal title:Sensors (Basel, Switzerland), 2019-09, Vol.19 (19), p.4231
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ArticlesPeer ReviewedFull Text
Cleanroom‐Free Direct Laser Micropatterning of Polymers for Organic Electrochemical Transistors in Logic Circuits and Glucose Biosensors
Author / Creator:Enrico, Alessandro ; Buchmann, Sebastian ; De Ferrari, Fabio ; Lin, Yunfan ; Wang, Yazhou ; Yue, Wan ; Mårtensson, Gustaf ; Stemme, Göran ; Hamedi, Mahiar Max ; Niklaus, Frank ; Herland, Anna ; Zeglio, Erica
Publisher:Germany: John Wiley & Sons, Inc
Journal title:Advanced science, 2024-07, Vol.11 (27), p.e2307042-n/a
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ArticlesPeer ReviewedFull Text
High‐rate metal‐free MXene microsupercapacitors on paper substrates
Author / Creator:Xue, Han ; Huang, Po‐Han ; Lai, Lee‐Lun ; Su, Yingchun ; Strömberg, Axel ; Cao, Gaolong ; Fan, Yuzhu ; Khartsev, Sergiy ; Göthelid, Mats ; Sun, Yan‐Ting ; Weissenrieder, Jonas ; Gylfason, Kristinn B. ; Niklaus, Frank ; Li, Jiantong
Publisher:Wiley
Journal title:Carbon energy, 2024-05, Vol.6 (5), p.n/a
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ArticlesPeer ReviewedFull Text
Ultrafast Metal‐Free Microsupercapacitor Arrays Directly Store Instantaneous High‐Voltage Electricity from Mechanical Energy Harvesters
Author / Creator:Chen, Shiqian ; Li, Zheng ; Huang, Po‐Han ; Ruiz, Virginia ; Su, Yingchun ; Fu, Yujie ; Alesanco, Yolanda ; Malm, B. Gunnar ; Niklaus, Frank ; Li, Jiantong
Publisher:Germany: John Wiley & Sons, Inc
Journal title:Advanced science, 2024-06, Vol.11 (22), p.e2400697-n/a
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ArticlesPeer ReviewedFull Text
Correction: Integrated silicon photonic MEMS
Author / Creator:Quack, Niels ; Takabayashi, Alain Yuji ; Sattari, Hamed ; Edinger, Pierre ; Jo, Gaehun ; Bleiker, Simon J. ; Errando-Herranz, Carlos ; Gylfason, Kristinn B. ; Niklaus, Frank ; Khan, Umar ; Verheyen, Peter ; Mallik, Arun Kumar ; Lee, Jun Su ; Jezzini, Moises ; Zand, Iman ; Morrissey, Padraic ; Antony, Cleitus ; O’Brien, Peter ; Bogaerts, Wim
Publisher:London: Nature Publishing Group UK
Journal title:Microsystems & nanoengineering, 2024, Vol.10 (1), p.17-1, Article 17
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ArticlesPeer ReviewedFull Text
A large-area single-filament infrared emitter and its application in a spectroscopic ethanol gas sensing system
Author / Creator:Schröder, Stephan ; Briano, Floria Ottonello ; Rödjegård, Henrik ; Bryzgalov, Maksym ; Orelund, Jonas ; Gylfason, Kristinn B. ; Stemme, Göran ; Niklaus, Frank
Publisher:London: Nature Publishing Group UK
Journal title:Microsystems & nanoengineering, 2021-10, Vol.7 (1), p.87-87, Article 87
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ArticlesPeer ReviewedFull Text
Vertical integration of microchips by magnetic assembly and edge wire bonding
Author / Creator:Ribet, Federico ; Wang, Xiaojing ; Laakso, Miku ; Pagliano, Simone ; Niklaus, Frank ; Roxhed, Niclas ; Stemme, Göran
Publisher:London: Nature Publishing Group UK
Journal title:Microsystems & nanoengineering, 2020-02, Vol.6 (1), p.12-12, Article 12
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Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
Author / Creator:Bleiker, Simon J ; Visser Taklo, Maaike M ; Lietaer, Nicolas ; Vogl, Andreas ; Bakke, Thor ; Niklaus, Frank
Publisher:Switzerland: MDPI AG
Journal title:Micromachines (Basel), 2016-10, Vol.7 (10), p.192-192
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ArticlesPeer ReviewedFull Text
Integrating MEMS and ICs
Author / Creator:Fischer, Andreas C ; sberg, Fredrik ; Lapisa, Martin ; Bleiker, Simon J ; Stemme, Göran ; Roxhed, Niclas ; Niklaus, Frank
Publisher:London: Springer Nature B.V
Journal title:Microsystems & nanoengineering, 2015-01, Vol.1, p.15005
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ArticlesPeer ReviewedFull Text
Manufacture and characterization of graphene membranes with suspended silicon proof masses for MEMS and NEMS applications
Author / Creator:Fan, Xuge ; Smith, Anderson D. ; Forsberg, Fredrik ; Wagner, Stefan ; Schröder, Stephan ; Akbari, Sayedeh Shirin Afyouni ; Fischer, Andreas C. ; Villanueva, Luis Guillermo ; Östling, Mikael ; Lemme, Max C. ; Niklaus, Frank
Publisher:London: Nature Publishing Group UK
Journal title:Microsystems & nanoengineering, 2020-04, Vol.6 (1), p.17-17, Article 17
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ArticlesPeer ReviewedFull Text
Large-Area Integration of Two-Dimensional Materials and Their Heterostructures Using Wafer Bonding
Author / Creator:Quellmalz, Arne ; Wang, Xiaojing ; Sawallich, Simon ; Uzlu, Burkay ; Otto, Martin ; Wagner, Stefan ; Wang, Zhenxing ; Prechtl, Maximilian ; Hartwig, Oliver ; Luo, Siwei ; Duesberg, Georg S. ; Lemme, Max ; Gylfason, Kristinn ; Roxhed, Niclas ; Stemme, Göran ; Niklaus, Frank
Journal title:Nature communications, 2021, Vol.12, p.917
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ArticlesPeer ReviewedFull Text
Special issue WaferBond’13: International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration
Author / Creator:Knechtel, Roy ; Niklaus, Frank ; Michel, Bernd
Publisher:Berlin/Heidelberg: Springer Berlin Heidelberg
Journal title:Microsystem technologies : sensors, actuators, systems integration, 2015-05, Vol.21 (5), p.951-951
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Select record 33
ArticlesPeer ReviewedFull Text
Design and fabrication of crack-junctions
Author / Creator:Dubois, Valentin ; Niklaus, Frank ; Stemme, Göran
Publisher:London: Nature Publishing Group UK
Journal title:Microsystems & nanoengineering, 2017-10, Vol.3 (1), p.17042-17042, Article 17042
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ArticlesPeer ReviewedFull Text
Inkjet printing technology for increasing the I/O density of 3D TSV interposers
Author / Creator:Khorramdel, Behnam ; Liljeholm, Jessica ; Laurila, Mika-Matti ; Lammi, Toni ; Mårtensson, Gustaf ; Ebefors, Thorbjörn ; Niklaus, Frank ; Mäntysalo, Matti
Publisher:London: Nature Publishing Group UK
Journal title:Microsystems & nanoengineering, 2017, Vol.3 (1), p.17002, Article 17002
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Select record 35
ArticlesFull Text
Suspended graphene membranes with attached silicon proof masses as piezoresistive NEMS accelerometers
Author / Creator:Fan, Xuge ; sberg, Fredrik ; Smith, Anderson D ; Schröder, Stephan ; Wagner, Stefan ; Östling, Mikael ; Lemme, Max C ; Niklaus, Frank
Publisher:Ithaca: Cornell University Library, arXiv.org
Journal title:arXiv.org, 2020-03
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ArticlesFull Text
3D printing of hierarchical structures made of inorganic silicon-rich glass featuring self-forming nanogratings
Author / Creator:Po-Han, Huang ; Chen, Shiqian ; Hartwig, Oliver ; Marschner, David E ; Duesberg, Georg S ; Stemme, Göran ; Li, Jiantong ; Gylfason, Kristinn B ; Niklaus, Frank
Publisher:Ithaca: Cornell University Library, arXiv.org
Journal title:arXiv.org, 2024-03
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ArticlesFull Text
Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers
Author / Creator:Fan, Xuge ; sberg, Fredrik ; Smith, Anderson D ; Schröder, Stephan ; Wagner, Stefan ; Rödjegård, Henrik ; Fischer, Andreas C ; Östling, Mikael ; Lemme, Max C ; Niklaus, Frank
Publisher:Ithaca: Cornell University Library, arXiv.org
Journal title:arXiv.org, 2020-03
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ArticlesFull Text
Nanoelectromechanical Sensors based on Suspended 2D Materials
Author / Creator:Lemme, Max C ; Wagner, Stefan ; Lee, Kangho ; Fan, Xuge ; Verbiest, Gerard J ; Wittmann, Sebastian ; Lukas, Sebastian ; Dolleman, Robin J ; Niklaus, Frank ; Herre S J van der Zant ; Duesberg, Georg S ; Steeneken, Peter G
Publisher:Ithaca: Cornell University Library, arXiv.org
Journal title:arXiv.org, 2020-07
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Select record 39
ArticlesFull Text
Manufacture and Characterization of Graphene Membranes with Suspended Silicon Proof Masses for MEMS and NEMS Applications
Author / Creator:Fan, Xuge ; Smith, Anderson D ; sberg, Fredrik ; Wagner, Stefan ; Schröder, Stephan ; Sayedeh Shirin Afyouni Akbari ; Fischer, Andreas C ; Villanueva, Luis Guillermo ; Östling, Mikael ; Lemme, Max C ; Niklaus, Frank
Publisher:Ithaca: Cornell University Library, arXiv.org
Journal title:arXiv.org, 2020-03
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ArticlesFull Text
Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices
Author / Creator:Dubois, Valentin ; Raja, Shyamprasad N ; Gehring, Pascal ; Caneva, Sabina ; Herre S J van der Zant ; Niklaus, Frank ; Stemme, Göran
Publisher:Ithaca: Cornell University Library, arXiv.org
Journal title:arXiv.org, 2018-09
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Carbon-Based Electrode Materials for Microsupercapacitors in Self-Powering Sensor Networks: Present and Future Development

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Cleanroom‐Free Direct Laser Micropatterning of Polymers for Organic Electrochemical Transistors in Logic Circuits and Glucose Biosensors

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High‐rate metal‐free MXene microsupercapacitors on paper substrates

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Ultrafast Metal‐Free Microsupercapacitor Arrays Directly Store Instantaneous High‐Voltage Electricity from Mechanical Energy Harvesters

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Correction: Integrated silicon photonic MEMS

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A large-area single-filament infrared emitter and its application in a spectroscopic ethanol gas sensing system

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Vertical integration of microchips by magnetic assembly and edge wire bonding

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Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

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Integrating MEMS and ICs

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Manufacture and characterization of graphene membranes with suspended silicon proof masses for MEMS and NEMS applications

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Large-Area Integration of Two-Dimensional Materials and Their Heterostructures Using Wafer Bonding

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Special issue WaferBond’13: International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration

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Design and fabrication of crack-junctions

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Inkjet printing technology for increasing the I/O density of 3D TSV interposers

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Suspended graphene membranes with attached silicon proof masses as piezoresistive NEMS accelerometers

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3D printing of hierarchical structures made of inorganic silicon-rich glass featuring self-forming nanogratings

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Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers

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Nanoelectromechanical Sensors based on Suspended 2D Materials

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Manufacture and Characterization of Graphene Membranes with Suspended Silicon Proof Masses for MEMS and NEMS Applications

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Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices

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